Abstract
We report here two processes for in-situ, self-aligned fabrication of niobium based Josephson tunnel junctions and SNS microbridges in which multiple evaporations at varying angles are made through a suspended metal stencil fabricated by electron beam lithography (EBL). Both techniques have proved superior to earlier all-polymer suspended masks, particularly with e-gun evaporated refractory metals such as niobium. The first process uses a trilevel resist and ion milling to pattern a gold stencil suspended on PMMA. In the second process, an aluminum stencil suspended on polyimide (PI) is patterned by lift-off with an EBL mask written in a PMMA layer on top of the PI. The PI is then undercut using an oxygen plasma etch through the aluminum mask. Reproducible (±20 nm) submicrometer dimensions and good junction characteristics have been achieved using these techniques without the need for difficult-to-control surface cleaning procedures.
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