Abstract
The effect of high thermal oxidation and different Ar plasma treatment parameters on different surface-treated Copper (Cu) LF were successfully evaluated through surface morphology, surface wettability, and mold-to- LF adhesion measurements. Different Cu LF surfaces showed various surface discoloration change and surface stability when exposed to high temperature process exposure. Among the three different Cu LF surfaces, Bare Cu and Rough Cu-plated surface showed robust and stable surface after high temperature exposure. Different Cu LF surfaces showed various surface morphological alterations and wettability improvement at varying Ar plasma treatment. Overall, the reliability assessment of mold adhesion integrity of different Cu LF surfaces at varying plasma settings showed favorable result at Bare Cu LF regardless of plasma parameters.
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