Surface scanning inspection system defect classification of CMP induced scratches

Abstract

The methodology of Surface Scanning Inspection System (SSIS) for the Chemical Mechanical Polish (CMP) Process is to inspect the wafers on a SSIS and then subsequently perform a Defect Review SEM (DRS) review of the detected surface and subsurface anomalies. The subsequent defect review on a DRS allows for the classification of defects into discrete classification bins. The challenge of utilizing an automated DRSEM on micro and macro scratches resides in the accurate classification. When the DRSEM Field of View (FOV) is too large or too small, the defect(s) may be incorrectly classified into the incorrect defect classification bin. An exploration of the feasibility of utilizing the Hitachi LS9100 Surface Scanning Inspection System to automatically classify Chemical Mechanical Polishing induced scratches as a means of bypassing subsequent Defect Review Scanning Electron Microscope Automatic Defect Classification steps is evaluated as one of the key indices into the accelerated release of new slurry products from research and development into full manufacturing