Abstract
This paper describes the formation of self-assembled monolayer of 1-(n-butyl)imidazole (BI) on electrode surface by self-assembly technique. Electrochemical impedance spectroscopy was conducted to establish the optimum concentration and assembling time of the BI SAM for the SAM formation. It was found that the BI monolayer was formed with the concentration of 1.0 mM of BI at 24 h assembling time and the maximum inhibition efficiency that could be attained is 93.2%. The resulting monolayer was characterized by Fourier transform infrared spectroscopy (FT-IR) and energy dispersive X-ray (EDX) analysis. The surface analysis confirmed that the BI molecule was self-assembled on the copper surface. The corrosion resistance ability of the SAM coated copper in 3% NaCl solution was investigated by potentiodynamic polarization studies, cyclic voltammetry, scanning electron microscopy. The result showed that the presence of BI monolayer on copper electrode resulted in better corrosion resistance against copper corrosion in NaCl medium.
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