Abstract
AbstractA surface‐mount bowtie antenna element with a ball grid array (BGA) packaging is proposed. Compared to a two‐dimensional end‐fire antenna, the proposed surface‐mount antenna element is a discrete three‐dimensional structure for obtaining a broadside radiation pattern. The proposed antenna element is mounted on the motherboard and fed by the balun located at the bottom layer of the motherboard to obtain a wide impedance bandwidth. In addition, the proposed antenna with the BGA packaging provides a cost‐effective solution for integration with surface‐mount devices on the same system board. The performance of the antenna prototype was verified by measurements.
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