Abstract
Abstract It has been long recognized that the understanding of mechanical properties of thin films on substrates requires an understanding of the stresses in the film structures as well as a knowledge of mechanisms by which thin films deform. It has also been shown that these stresses may compromise the performance of integrated circuits, magnetic media, etc. The presence of residual and thermal stresses between the matrix and intergranular films in structural multiphase ceramics is the most common mechanism of failure that often causes deformation and fracture In this paper, the effect of residual stress on mechanical properties of silicate-glass films on single-crystal α-Al2O3 substrates has been studied with AFM with the emphasis on the changes in surface morphology associated with the film strain and relaxation. The deformation of thin layers of glass on crystalline materials has also been examined using newly developed experimental methods for nanomechanical testing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
