Abstract

Up to now, the reported methods to regulate the surface morphology of metals are complicated and thus difficult to achieve. Herein, the etching method is optimized and used to change the surface morphology of copper (Cu) wire. By adjusting the amount of HCl as etching agent and the purity of Cu wire as the raw material, the Cu wire covered by uniform submicro-sized cubes (CWC) is successfully prepared and chosen as catalyst for the reduction of 4-nitrophenol. The CWC shows superior catalytic activity, recyclability and stability. Clearly, the as-provided etching method is effective for the surface morphology control of Cu wire, which can be a prospective strategy to obtain the metal materials with special surface morphology.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.