Abstract
AbstractThis chapter aimed to provide a general overview of several surface modifications’ techniques of ceramic reinforcements on the properties of composite solders. It is commonly known that composite solders experienced significant aggregation and non-wetting issues between the ceramic reinforcements and solder matrix, which makes the addition of the reinforcement phase inefficient in improving the properties of lead-free solders. Surface modification techniques such as pyrolysis, chemical route surface modification and metal plating have been developed over the years to address this issue and have shown progressive impact in improving the interface of the reinforcements and solder matrix. The chapter highlights the fundamental understanding, main parameters and setup, and latest developments on the surface-modified ceramic-reinforced composite lead-free solders. Finally, the chapter also summarised and discussed the advantages, current trends, and significant findings in this field.KeywordsLead-free solderCompositeSurface modificationsCeramic reinforcements
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
