Surface modification of polyimide films by argon plasma for copper metallization on microelectronic flex substrates

Abstract

AbstractSurface modification of polyimide films such as Kapton E(N) and Upilex S by argon plasma was investigated because of the enhanced adhesive strength with sputtered copper. Peel tests demonstrated this improvement, with a peel strength of 0.7 and 1.2 g/mm for unmodified Kapton E(N) and Upilex S, respectively, and 110.3 and 98 g/mm for argon plasma–modified Kapton E(N) and Upilex S, respectively, in certain plasma conditions. This study showed that the enhanced adhesive strength of polyimide films with sputtered copper by argon plasma was strongly affected by the surface characteristics such as surface morphology and surface energy of polyimide films. Atomic force microscopy and the sessile drop method indicated that the surface roughness and surface energy of the polyimide films were greatly increased by argon plasma, resulting in highly increased peel strength of the polyimide films with sputtered copper. It was observed in electron spectroscopy for chemical analysis (ESCA) that the increased surface energy of the polyimide films from argon plasma was a result of more of the surface being composed of O and N and of the increased number of CO, CO, and CN chemical bonds. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 744–755, 2006