Abstract

The surfaces of polyimide (PI) films have been treated by exposure to Ar-ECR plasma (ion energy of 10–20 eV) to understand the effects of very-low-energy ions on the surface modification of PI. These effects were monitored by X-ray photoelectron spectroscopy (XPS) as a function of ion dose and compared to those treated by an Ar + beam (ion energy of 600 eV). Our data indicate that (1) Ar-ECR plasma treatment causes the same type of chemical surface modification as conventional ion beams, (2) it is more efficient than Ar + beam in surface treatment within our effective sampling depth, and (3) a region of depth ~ 40 Å is modified at an ion dose of 2 × 10 17ions/cm 2.

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