Abstract
The high-precision, low-damage patterning by laser-induced back side etching techniques is still of interest, particularly for ultra-precision engineering, although the mechanism is not yet clear. The drastically altered optical properties of fused silica etched with LESAL (laser etching at a surface-absorbed layer) give evidence for the etching mechanism. Depth-resolved UV/Vis spectroscopic measurements show that the modified layer is limited to a depth of ~60nm. This is correlated with a very high calculated absorption coefficient of ~4×107m−1 of the modified surface layer. With Rutherford backscattering spectrometry (RBS) measurements on LESAL-modified surfaces, it was demonstrated that in dependence on the laser fluence used, an amorphized layer with a thickness of a few nanometers was generated. The RBS measurements show that carbon is incorporated into the LESAL-modified surface.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
