Abstract
The effects of the wet-chemical and plasma treatments on the adhesion of electroless and sputter-deposited copper to the photodefinable epoxy have been investigated. The wet-chemical treatment increased the amounts of oxygen-containing functionalities on the epoxy surface mainly during the early stage of etching. With the longer etching the pronounced surface roughness was revealed in the form of microcavities. The plasma treatment increased significantly the polar component of surface free energy of the epoxy and produced low surface roughness. The physicochemical changes of the epoxy combined with the experimental adhesion results indicated that in the case of the electroless deposition the mechanical interlocking was the main adhesion mechanism. Sputter-deposited copper exhibited the highest pull strengths on the epoxy when the plasma pretreatment with oxygen was employed. The enhancement of the surface polarity of the epoxy and the enlarged surface contact area due to the increased roughness were the most important factors in the adhesion.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
