Abstract
A downstream microwave plasma etcher with in situ diagnostics has been constructed to elucidate the chemical mechanisms in plasma etching of polyphenylene oxide (PPO). reactant gases are used. Stable reaction products are investigated with mass spectrometry while reactive‐free radical information is obtained using optical emission spectroscopy. Additionally, the weight loss of PPO is measured to determine average etch rate. A linear correlation between weight loss measurements of PPO laminates and integration of CO and formation measured by mass spectrometry suggests that real‐time monitoring of polymer etching can be achieved. Etching dynamics are studied with gas compositions of varied from 6.6 to 30%. The etch process exhibits a dynamic reduction in rate with . spectra of X‐ray photoelectron spectroscopy show an increase in fluorination of the etched surface with . A kinetic model based on the dynamic change of the number of carbon sites that are fluorinated is proposed. © 2000 The Electrochemical Society. All rights reserved.
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