Abstract
AbstractThe application of surface analysis techniques for the study of fundamental surface and thin film phenomena is described. The topics covered relate to the processing and fabrication of electronic packages and include: evaporation/condensation during the thermal processing of glasses, hydration of glass surfaces and thin films, nitridation of silica films, diffusion behavior in oxides at low temperature, and impurity segregation in thin films. A wide variety of surface analytical methods are exemplified including Auger electron spectroscopy (AES), ion-scattering spectroscopy (ISS), nuclear reaction analysis (NRA), secondary-ion mass spectroscopy (SIMS) and x-ray photoelectron spectroscopy (XPS).
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