Abstract
Pattern writing on insulating materials (e.g. quartz) using electron beam lithography (EBL) is a challenging task and it is even more difficult when the pattern is three dimensional (3D). Surface charging trapped on insulating substrates may deflect the electron beam during electron beam pattern writing causing undesired effects. In this work, the surface charging has been suppressed by top coating with water soluble conductive polymer layer using poly (3,4-Etylenedioxythiophene)/poly(styrenesulfonate) (PEDOT/PSS). The 3D masking profiles are created on a negative tone photoresist (Microresist, ma-N2403) using Raith150 EBL tool with variable dose controlled beam exposure. The 3D patterns have been transferred onto the quartz substrate by single step reactive ion etching (RIE) with suitable resist to substrate selectivity. We have demonstrated the fabrication of 3D geometrical shapes such as pyramids, hemispheres, and cones with dimensions down to 300 nm using this technique without any surface charging effects.
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