Abstract
The objective of this research is to understand the fundamental mechanisms that govern the formation of laser-induced molten area during the micro-grooved fabrication on silicon material. In this research work, micro grooves were fabricated on silicon wafer by using ultraviolet (UV) laser of 248nm wavelength. Influence of lasing parameters such as pulse duration, laser pulse energy and scanning speed on the surface of micro-grooved was characterized. It is found that, the width of the micro grooves become wider with increasing laser pulse energy when ultraviolet laser was irradiated on silicon material. On the other hand, heat affected zone (HAZ) can be found at the surface of micro groove line at high pulse energy, high pulse repetition rate and lower scanning speed irradiation condition. This is considered due to the excessive heat input of the laser irradiation condition. It is concluded that proper selection of laser processing parameters of pulse energy, E, pulse repetition rate, R p , and scanning speed is necessary to achieve high quality micro-grooves.
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