Abstract
Scanning electron microscopy has been used to investigate changes in surface morphology due to helium implantation and hydrogen charging. Pure polycrystalline nickel, OFHC copper and Cu1.8Be0.2Co (CAD 172) alloy have been studied. The influence of helium implantation parameters on blister formation and growth was investigated. Hydrogen charging (cathodic or thermal-gas) was found to lower the helium content needed for blistering and surface exfoliation. The effect of heating, carried out after hydrogen charging, was also studied. For the copper samples, hydrogen damage was produced by oxide reduction at the oxide-metal interface. This damage was found to be lower when the sputtering due to helium implantation increased. The CuBe alloy showed a greater hydrogen resistance due to the stability of the surface BeO.
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