Surface and subsurface integrity in diamond grinding of optical glasses on Tetraform ‘C’

Abstract

In order to investigate the surface and subsurface integrity of diamond-ground optical glasses, a Tetraform ‘C’ machine tool featuring high close-loop stiffness was used to conduct the ultra-precision machining of fused silica and fused quartz assisted with electrolytic in-process dressing (ELID). An acoustic emission (AE) sensor and a piezoelectric dynamometer were used to monitor the grinding process to correlate the processing characteristics with the generated surface and subsurface integrities, which were characterized by atomic force microscope (AFM), scanning electronic microscope (SEM), and nano-indentation technique. Experimental results showed that for optical glasses the fracture toughness value can be used to predict the machinability while its bigger value always means a better surface and subsurface integrity. During the grinding process of optical glasses, the smaller amplitude and RMS values of AE signal, as well as the smaller grinding forces and the ratio of normal force to tangential force, correspond to a better surface and subsurface integrity. With selected machining parameters and a 6–12 μm grain-sized diamond-grinding wheel, nanometric quality surfaces (Ra<5 nm) with minimal subsurface damage depth (< 0.5 μm) can be generated for fused quartz on Tetraform ‘C’.