Surface and defect correlation studies on high resistivity 4H SiC bulk crystals and epitaxial layers for radiation detectors

Abstract

Radiation detectors have been fabricated using bulk semi-insulating (SI) 4H-SiC crystals and SI and n-type 4H-SiC epitaxial layers grown by chemical vapor deposition (CVD) on highly doped (0001) 4H-SiC substrates. The devices have been characterized by optical microscopy, current-voltage (I-V) measurements, thermally stimulated current (TSC) spectroscopy (94K - 650 K), Hall effect, van der Pauw measurements, and electron beam induced current (EBIC) technique. Both epitaxial layers exhibited relatively shallow levels related to Al, B, L- and D- centers. Deep level centers in the n-type epitaxial layer peaked at ~ 400 K (E a ~ 1.1 eV) and ~ 470 K were correlated with IL2 defect and 1.1 eV center in high purity bulk SI 4H-SiC. The SI epitaxial layer exhibited peak at ~ 290 K (E a = 0.82 - 0.87 eV) that was attributed to IL1 center and 3C inclusions, and at ~ 525 K that was related to intrinsic defects and their complexes with energy levels close to the middle of the band gap. The TSC spectra of the SI epitaxial layer exhibited peaks with different current polarity which we attributed to the built-in electric field reversal. Results of EBIC and optical microscopy characterization showed segregation of threading dislocations around comet tail defects in the n-type epitaxial layers and presence of stacking faults and 3C-SiC inclusions in both epitaxial layers. The I-V characteristics of the devices on SI epi obtained in wide temperature range (94K - 650 K) exhibited steps at ~ 1 V and ~ 70 V corresponding to the ultimate trap filling of deep centers peaked at > 500 K and at ~ 250 K (E a ~ 0.57 eV), & ~ 300 K (E a ~ 0.85 eV) respectively. Slow processes of the injected carrier capture on traps resulted in the I-V characteristic with negative differential resistance (NDR). The high temperature resistivity measurements of bulk SI 4H-SiC sample revealed resistivity hysteresis that was attributed to the filling of the deep level electron trap centers.