Abstract
In this study, we investigate a future high-speed real time analog signal processing circuit by co-integrating a semiconductor active array device with a surface acoustic wave (SAW) device in one chip. We propose a novel semiconductor coupled SAW functional device with a traveling wave amplifier structure and show basic characteristics of the devices using a circuit simulator. Using epitaxial liftoff film bonding technology, we fabricated a basic test device on LiNbO3 substrate and measured the basic characteristics of the functional device.
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