Surface Acoustic Wave Dispersion Studies on the Layered CU/SI Structure Using Scanning Acoustic Microscopy

Abstract

Surface acoustic wave (SAW) dispersion studies on the layered Cu/Si structures for the elastic characterization have been performed by scanning acoustic microscopy (SAM). The bonding quality at the interface has been also evaluated by examining the SAW dispersion changes. We have proposed an interface layer modeling approach to interpret the experimental results and to examine the elastic properties at the interface. The studies have shown that the behaviors of Sezawa wave is very sensitive to the interface properties and the bonding conditions in the used samples.