Abstract
Electrodeposited (ED) Cu was prepared and exhibited a strong voiding propensity at the Cu3Sn/Cu interface in the subsequent Sn3.0Ag0.5Cu/Cu solder joint. However, we found that the rapid thermal processing treatment could significantly reduce the voiding propensity of ED Cu. After rapid annealing, the grain size of Cu was obviously increased, which was found to reduce the amount of effective vacancies and lower the driving force of void formation. Meanwhile, the ED Cu before and after rapid annealing was analyzed using X-ray photoelectron spectroscopy, and it can be found that there did exist additives remained in the Cu layer during electroplating process. However, after rapid annealing treatment, some residuals would evaporate, and the others would decompose and react with Cu, which would change the residuals from the free state to the “deactivated” state and make them lose their acting as the precipitate for the heterogeneous nucleation. Thus, the Cu3Sn/Cu interface with few voids was finally formed.
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