Suppression of Ge–O and Ge–N bonding at Ge–HfO 2 and Ge–TiO 2 interfaces by deposition onto plasma-nitrided passivated Ge substrates: Integration issues Ge gate stacks into advanced devices

Abstract

A study of changes in nano-scale morphology of thin films of nano-crystalline transition metal (TM) elemental oxides, HfO 2 and TiO 2, on plasma-nitrided Ge(1 0 0) substrates, and Si(1 0 0) substrates with ultra-thin (∼0.8 nm) plasma-nitrided Si suboxide, SiO x , x < 2, or SiON interfacial layers is presented. Near edge X-ray absorption spectroscopy (NEXAS) has been used to determine nano-scale morphology of these films by Jahn-Teller distortion removal of band edge d-state degeneracies. These results identify a new and novel application for NEXAS based on the resonant character of the respective O K 1 and N K 1 edge absorptions. This paper also includes a brief discussion of the integration issues for the introduction of this Ge breakthrough into advanced semiconductor circuits and systems. This includes a comparison of nano-crystalline and non-crystalline dielectrics, as well as issues relative to metal gates.