Abstract
This paper investigated the intermetallic compound (IMC) layer that formed in Sn-0.7Cu-0.05Ni+1wt.% TiO2 (SCNT) composite solder paste added with reinforcement (TiO2) particles. Besides, the growth of the IMC layer during subsequent aging at temperature of 75 °C, 125 °C and 150 °C also being studied. Scanning electron microscopy was used to observe the IMC growth and to measure the thickness of IMC layer. The interfacial IMC layer has been suppressed whereas the activation energy value of the composite solder paste was high (37.35 kJ/mol) which in turn improved the thermal stability of the IMC layer. Results also show the IMC formed at bulk solder microstructure of SCNT solder paste composite was refined. The presence of TiO2 particles has become the obstacle for the Cu atom diffusion from the substrate to the solder and Sn atom from the solder, thus, successful for the suppression of the IMC layer.
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