Abstract
This study investigated the effects of adding 0.5 wt.% nano-TiO 2 particles into Sn3.5Ag0.5Cu (SAC) lead-free solder alloys on the growth of intermetallic compounds (IMC) with Cu substrates during solid-state isothermal aging at temperatures of 100, 125, 150, and 175 °C for up to 7 days. The results indicate that the morphology of the Cu 6Sn 5 phase transformed from scallop-type to layer-type in both SAC solder/Cu joints and Sn3.5Ag0.5Cu–0.5 wt.% TiO 2 (SAC) composite solder/Cu joints. In the SAC solder/Cu joints, a few coarse Ag 3Sn particles were embedded in the Cu 6Sn 5 surface and grew with prolonged aging time. However, in the SAC composite solder/Cu aging, a great number of nano-Ag 3Sn particles were absorbed in the Cu 6Sn 5 surface. The morphology of adsorption of nano-Ag 3Sn particles changed dramatically from adsorption-type to moss-type, and the size of the particles increased. The apparent activation energies for the growth of overall IMC layers were calculated as 42.48 kJ/mol for SAC solder and 60.31 kJ/mol for SAC composite solder. The reduced diffusion coefficient was confirmed for the SAC composite solder/Cu joints.
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