Abstract
To achieve the superheat-resistant polymers for flexible display substrates, two new diamines, namely 6-amine-2-(4-aminobenzene)-1-methyl-benzimidazole (m-MePABZ), 5-amine-2-(4-amino-benzene)-1-methyl-benzimidazole (p-MePABZ) containing N-methyl benzimidazole (BI) were synthesized and a serials of poly(benzimidazole imide) (PBII) films were prepared through thermal imidization. Among them, the flexible polyimide (PI) film derived from m-MePABZ and pyromellitic dianhydride (PMDA) has an ultra-low coefficient of thermal expansion (CTE) down to 2.5 ppm K−1 and an outstanding high glass-transition temperature (Tg) up to 431 °C. Furthermore, the employment of N-methyl overcame an issue of the high H2O-absorption of traditional PBIIs, and the effect of “para-” and “meta-connecting” methyl on molecular packing and properties of these PIs was investigated. These data provided a useful guide to develop high performance PBIIs by incorporating N-methyl.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
