Abstract
Silicon micro-machined Optical Sub-Assemblies (OSA) are becoming increasingly popular in packaging of photonic devices. Good thermal conductivity of silicon, for heat sinking, ability to etch precisely controlled grooves, for fiber alignment, availability of good quality wafers, developed processing technology, and batch processing are some of the advantages that are inherent to this approach, which we call Silicon Optical Bench (SiOB) technology. It is often desirable to be able to define photolithographically patterns in close proximity to deep grooves or at the bottom of such grooves. Typical features required are: wire bonding pads, device soldering pads, alignment marks, turning mirrors, thin film heaters, coplanar microstrips, etc.
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