Abstract
The extent and distribution of the subsurface damage in ultraprecision machined CdS was examined by the use of ion channeling using glancing angle detector positioning to provide enhanced depth resolution. Single crystal (0001) oriented CdS was diamond turned over the range of depths of cut of 0.1 – 10 μm, and subsurface lattice disorder was examined for regions cut parallel to, and 30 degrees off, a preferred cleavage plane. Damage depths for the crystals machined along a preferred cleavage plane were found to be consistently larger than those machined 30 degrees off the plane.
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