Sub-Structure and Residual Stress in Rotary Swaged Cu/Al Clad Composite Wires

Abstract

This study investigated the prospective application of the advantageous intensive plastic deformation method of rotary swaging for production of Al-Cu composite wires. Such materials are perspective to be used within a wide range of commercial and industrial branches, from transportation to electrotechnics. Cu-Al laminated wires with two unique different stacking sequences were rotary swaged down to 5 mm diameter at room temperature to minimize the development of brittle intermetallics at the interfaces. The analyses primarily focused on the mutual comparison of both the stacking sequences (Al sheath reinforced with Cu wires vs. Al sheath and Al core reinforced with Cu inter-layer) from the viewpoints of mechanical properties, sub-structure development, and occurrence of residual stress. While the individual Cu wires exhibited bimodal structure and the presence of residual stress within the growing grains, the Cu inter-layer featured recrystallized grains and homogeneous stress distribution. The mechanical properties for both the composites were enhanced by the swaging technology; the composite reinforced with Cu wires exhibited slightly higher ultimate tensile strength than the one with Cu inter-layer (258 MPa vs. 276 MPa). However, the latter featured significantly higher plasticity.