Abstract
Microstructures and resistivities of sputtered Ru films were investigated as a function of substrate temperature to obtain a single-layered Ru barrier without a Ta/TaN under layer. High resistivity Ru films with a high density of crevices, which enhances Cu diffusion along the crevices, were formed by the conventional sputtering process, i.e., sputtering at room temperature and annealing at 400 °C–700 °C for 30 min in Ar + 3%H 2. But, crevice-free and smooth Ru films with low resistivity, the same as that for the bulk phase, were formed when substrate temperature add sputtering was raised to 700 °C. Ru films formed by this process had (002) preferred orientation and then Cu (111) was formed by plating. This result corresponded to the tendency predicted by ab initio calculations.
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