Substrate Integrated Waveguide Directional Couplers for Compact Three-Dimensional Integrated Circuits

Abstract

A class of directional couplers based on the substrate integrated waveguide (SIW) technique for compact three-dimensional (3-D) integrated circuits is proposed and studied in this work. Backward and forward couplers as well as strong coupling-defined forward couplers are presented and developed. They are composed of two joined SIW sections such that the common wall between them is made of a portion of the broad side of the first SIW and the narrow side of the second SIW. This perpendicular topology is arranged and formed through the use of a LEGO-like interconnect between the two SIW structures. Different coupling geometries developed with a low-cost printed circuit board process are studied. Design considerations and measured results at $Ka$ -band are presented and discussed. To achieve respectively weak backward and forward directional couplings, Schwinger and multihole-type directional couplers are introduced first of all, which make use of coupling slots arranged around the center of the SIW broad wall. For each of those structures, a wideband 20-dB directional coupler is fabricated and measured for demonstration purposes. To achieve a strong coupling, a Riblet-type directional coupler is proposed and examined. Subsequently, a 3-dB coupler is demonstrated together with a 0-dB coupler, offering a wideband and very efficient transition between the perpendicularly arranged SIWs. The proposed directional couplers can be used at millimeter-wave frequencies for probing and the design of compact 3-D integrated circuits and systems such as polarimetric imaging radiometer or antenna array feeding networks.