Substrate integrated suspended line to air-filled SIW transition for high-performance millimeter-wave multilayer integration

Abstract

Substrate integrated suspended line (SISL) and air-filled substrate integrated waveguide (AFSIW) technological platforms have been recently reported. They are both of high interest in the design of high-performance integrated millimeter-wave systems based on low-cost multilayer printed circuit board (PCB) technologies. This has been confirmed through simulations and experiments when comparing the insertion loss at Ka-band of the SISL and AFSIW with other conventional transmission lines. To take advantage of both platforms and interconnect SISL and AFSIW structures and circuits, a broadband SISL to AFSIW transition is reported. For demonstration purpose, a back-to-back transition operating over the Ka-band has been designed and fabricated. It achieves a matching of better than −15 dB and an insertion loss of 0.27 ±0.22 dB (0.11 ±0.06 dB for the transition) over the Ka-band.