Abstract
During conventional wafer level testing of integrated circuits, temporary electrical connections are formed by tungsten needles. There is a desire to replace this technology since it is becoming increasingly difficult to assemble probes with the required geometric tolerances. Furthermore, the forces exerted can damage the device under test. We describe a novel process for the fabrication of non-planar nickel cantilevers. The process is low temperature and independent of the substrate material, which allows the cantilevers to be fabricated on to previously processed wafers. Finally, examples of fabricated devices are discussed.
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