Abstract
The single wafer processing of epitaxial Si films requires that special attention be paid to the design of the substrate heater assembly. This document describes the evolution and testing of an in situ heater used to deposit epitaxial Si films at temperatures as high as 700 °C. One problem encountered was the production of excessive levels of ultraviolet radiation which contributed to the desorption of water vapor from the vacuum chamber walls during the in situ cleaning process. A second problem involved the formation of a molybdenum containing film that poisoned epitaxial growth. A final proven in situ heater design is presented which avoids these problems.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
