Abstract
Three-dimensional (3D) microstructure writing using the two photon absorption (TPA) process has potential applications in the fabrication of photonic crystals and micromechanical devices. Ormocore and SU-8, two commercially available photoresists, were used to produce 3D structures and compare their writing performances. A 40X objective (NA 0.65) was used to produce high aspect ratio structures with high resolution. The resultant widths and heights of the lines written in the resists were measured for various exposure conditions. Walls with ~320 nm width and aspect ratios of ~40 were produced in Ormocore. Other standing 3D structures were also written to demonstrate the capability of the resists.
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