Abstract
There is currently a need for the ability to perform high-resolution sub-surface materials characterization and inspection. In the microelectronics industry, with the decrease of line widths and the increase of component densities, sub-surface voids become increasingly detrimental. Any voids along an integrated circuit (IC) line can lead to improper electrical connections between components and cause failure of the device. In the thin film industry, the detection of impurities is also important. Any impurities can detract from the film’s desired optical, electrical, or mechanical properties. To study these effects, we have combined the sub-surface inspection capabilities of ultrasonics with the high resolution surface characterization capabilities of the near-field scanning optical microscope (NSOM).
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