Abstract

A method is presented for fabricating submicrometer and nanometer structures on epitaxial films of a IV–VI compound semiconductor on a Si(111) substrate by sputtering with an RF-induction Ar plasma. The role is identified of threading dislocations and terraces on the film surface in the formation of submicrometer and nanometer hillocks. The relationship is determined of sputtering parameters to the RF bias and process time. The self-formation of submicrometer hillocks is traced to dislocation exit sites being masked by Al-containing components.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.