Abstract
ABSTRACTIonized Metal Plasma (IMP) technology has been developed for liners and wetting layer deposition of sub-quarter-micron devices. Numerical modeling showed the unique advantages of IMP source over ECR source and long throw sputtering in enhancing bottom coverage. Ti and TiN bottom coverage up to 70% were demonstrated on 0.18μm contact holes. The deposition rate, uniformity, bottom coverage and film stress were optimized by tuning RF and DC powers, process pressure and bias power. In situ TiSi2 were formed in high aspect ratio contacts by depositing IMP Ti at an elevated temperature. The precisely controlled microstructure of IMP TiN film enabled low temperature aluminum planarization. The extendibility to 0.13μm technology node was demonstrated, and the application in copper metallization was revealed.
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