Sub-Milliwatt Transceiver IC for Transcutaneous Communication of an Intracortical Visual Prosthesis

Abstract

An intracortical visual prosthesis plays a vital role in partially restoring the faculty of sight in visually impaired people. Reliable high date rate wireless links are needed for transcutaneous communication. Such wireless communication should receive stimulation data (downlink) and send out neural recorded data (uplink). Hence, there is a need for an implanted transceiver that is low-power and delivers sufficient data rate for both uplink and downlink. In this paper, we propose an integrated circuit (IC) solution based on impulse radio ultrawideband using on-off keying modulation (OOK IR-UWB) for the uplink transmitter, and binary phase-shift keying (BPSK) with sampling and digital detection for the downlink receiver. To make the solution low-power, predominantly digital components are used in the presented transceiver test-chip. Current-controlled oscillators and an impulse generator provide tunability and complete the on-chip integration. The transceiver test-IC is fabricated in 180 nm CMOS technology and occupies only 0.0272 mm2. At 1.3 V power supply, only 0.2 mW is consumed for the BPSK receiver and 0.3 mW for the IR-UWB transmitter in the transceiver IC, while delivering 1 Mbps and 50 Mbps, respectively. Our link budget analysis shows that this test chip is suitable for intracortical integration considering the future off-chip antennas/coils transcutaneous 3–7 mm communication with the outer side. Hence, our work will enable realistic wireless links for the intracortical visual prosthesis.