Sub-Kelvin single flux quantum control circuits and multi-chip packaging for supporting superconducting qubit

Abstract

Superconducting single flux quantum (SFQ) circuit can operate at very low temperature. This is suitable for controlling a quantum computing system with Josephson junctions. However, it is difficult to integrate both SFQ circuits and qubits into a single-chip, because of the dissipative characteristics of SFQ circuits. Therefore, we have developed a multi-chip packaging technology for a qubit control module. The module consists of SFQ circuit chips, qubit chips, and a substrate all of which are fabricated with Nb and Al technology. The chips are flip-chip bonded with superconducting solder bumps. We also investigated SFQ control circuits for superconducting qubits and circuit parameter optimization for sub-Kelvin temperature operation. Using both multi-chip packaging and optimized SFQ control circuit makes the design of qubit control module more flexible.