Abstract

ABSTRACTWe observe that the formation of low angle grain boundaries (sub-boundaries) depends strongly on the thickness of the recrystallized Si film. The average lateral spacing between adjacent sub-boundaries increases from 40 μm for 4000Å films to 500 μm for unseeded Si films 30 μm thick. For seeded 30 μm Si films on 1.6 mm by 1.6 mm buried oxide islands, areas exceeding 1.0 mm by 1.0 mm have been recrystallized which are free of all sub-boundaries, but which contain dislocations in other configurations.

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