Abstract
The effect of the deposition temperature on the morphology of hemispherical-grain polycrystalline silicon (HSG-Si) films obtained by low-pressure chemical vapor deposition (LPCVD) has been studied using atomic force microscopy. The dependences of the relative surface area increment, density of grains, average height and lateral size of grains, mean square roughness, and correlation length on the deposition temperature have been determined in an interval used for the LPCVD growth of HSG-Si films.
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