Abstract
Grain-boundary stresses in copper for 60 symmetrical tilt grain boundaries with different orientations of the grain-boundary plane and tilt axis have been calculated by the molecular-statics method with the use of embedded-atom-method potentials of interatomic interaction. It has been established that the grain-boundary stresses are negative for grain boundaries with small excess volumes and increase approximately linearly with a buildup of the excess volume. It has been shown that the increase in grain-boundary stresses is connected with a decrease in the average coordination number of atoms, whereas pairs of closely spaced atoms in the grain-boundary core cause a negative contribution to grain-boundary stresses.
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