Abstract
A simple apparatus based on the hammer and anvil principle has been constructed and used to study the microstructure of aluminum 30% Silicon (Al-30% Si) foils with different thicknesses. Both (hammer and anvil) have been fabricated from oxygen free of high conductivity (OFHC) red copper. The cooling rate achieved or estimated was to be in the range of 1.67x104: 5x104 k sec-1. Microstructure studying of rapidly quenched Al-30% Si foils indicated that with decreasing the foil thickness the size of primarily Si crystalline decreases in the whole investigated range. However the volume fraction of the primarily silicon crystals in the structure remained constant down to thickness 0.3 mm; with further decreasing of the thickness the primarily silicon volume started to decreases.
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