Abstract
Epoxy resin has attracted widespread attention in the field of power electronic packaging due to its favorable processing technology, high adhesion, and excellent dielectric properties. The enhancement of thermal conductivity in epoxy resin through the incorporation of diverse particles is a prominent area of interest in the realm of modified insulation materials. In this study, hexagonal boron nitride (h-BN) and silicon dioxide (SiO2) with good thermal conductivity were used as doped fillers to modify epoxy resin (EP). The analysis of experimental results indicated that the thermal conductivity of materials with a total doping amount of 20 wt% and a mass ratio of BN to SiO2 of 70:30 to 60:40 could increase the thermal conductivity by 118.1~126.0%. In contrast to pure EP, the thermal conductivity of composite epoxy resin materials has been significantly enhanced.
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