Abstract
Thermal expansion behavior of Al, Ti, Mo, stainless steel and Fe–Ni alloy foils, which could be used for the substrate of flexible solar cells, were studied experimentally using thermomechanical analyzer (TMA). Electroformed Fe–Ni alloy foils and commercially available 50 μm thick Al, Ti, Mo and stainless steel were used for experiment. The thermal stresses and the displacement of solar cell systems consisted of metal foil substrate and virtual CIS top cell were numerically analyzed. Then measured coefficient of thermal expansion of metal foils and reference thermal expansion coefficient of CIS were used to compute the thermal stresses and the displacement of the thin film layers and the substrates of solar cell systems.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
