Study on the thermal performance of pulmonary vascular-inspired grooved vapor chamber

Abstract

The increasing miniaturization and integration of electronic devices have led to higher requirements for heat dissipation. To further enhance the heat transfer performance of the vapor chamber, this study proposes a novel vapor chamber with a pulmonary vascular-inspired grooved wick. Through a combined approach of numerical simulation and experimental research, the thermal performance of the proposed vapor chamber is tested and compared with the radially grooved vapor chamber(RGVC) of the same size and copper plate. The results demonstrate that within the heating power range of 0 W-30 W, the pulmonary vascular-inspired grooved vapor chamber(PGVC) exhibits superior temperature uniformity and heat transport capability. Under a heat load of 25 W, its thermal resistance is reduced by 52.73 % and 21.21 % compared to the copper plate and RGVC, respectively, while the heat transfer coefficient is increased by 107.61 % and 25.86 %, respectively. Furthermore, the PGVC achieves optimum performance at a liquid filling ratio of 75 %, with a remarkably low thermal resistance of 0.23℃/W at a heat load of 30 W.