Abstract
Three types of Cu/Al joints with different interfacial microstructures prepared by diffusion bonding, friction stir welding, and explosive welding were obtained, and the interfacial thermal conductivity was emphatically discussed in this paper. Two layers of intermetallic compounds with a width of 5∼12 μm were formed in the joint prepared by diffusion bonding. And a mixture of a supersaturated solid solution and few dispersed compounds with a thickness less than 1 μm was formed in the friction stir welding Cu/Al joint. The bonding interface of the Cu/Al explosive welding joint presented a wavy-like morphology with a width of 300∼350 μm. The interfacial thermal conductivity with different interfacial microstructure was calculated analytically using the acoustic mismatch model and compared with the measured value of the joints. The interfacial thermal conductivity mainly depends on the type of interfacial phase and its thickness. The calculated result showed that the interfacial thermal conductivity of friction stir welding joint was the highest (1∼8 × 107 W m−2·K−1). The experiment results suggested that the interfacial thermal conductivity showed the trend that explosive welding < friction stir welding < diffusion bonding.
Highlights
As a typical thermal/electrical component, Cu/Al hybrid structures have been widely used in industries such as circuit transmission, heat dissipation, shipbuilding, hydrometallurgy, and other fields [1–3]
Three types of Cu/Al joints with different interfacial microstructures prepared by diffusion bonding (DB), friction stir welding (FSW), and explosion welding (EW) were obtained and evaluated. e microstructures and compositions of the Cu/Al joints were investigated. e thermal conductivity was estimated, and the corresponding interface thermal conductivity model was built. e influence of different interface structures and thicknesses on the thermal conductivity of Cu/Al joints was analyzed
DB, FSW, and EW were used to fabricate Cu/Al joints in this study. e microstructure and thermal conductivity properties of Cu/ Al joints with different interface structures obtained by three methods are emphatically discussed
Summary
As a typical thermal/electrical component, Cu/Al hybrid structures have been widely used in industries such as circuit transmission, heat dissipation, shipbuilding, hydrometallurgy, and other fields [1–3]. Cu/Al hybrid plate radiator can realize the effective combination of thermal conductivity and heat dissipation, and improve the cost performance [5]. All of these Cu/Al structures are related to the Cu/Al heterogeneous joining. The interfacial thermal resistance seriously affects the thermal conductivity of the joint and has great influence on the service life when it is used as a conductive component. It has great practical significance to study the interfacial thermal conductivity of Cu/Al joint and reveal the thermal conductivity mechanism of Cu/Al heterogeneous interface with different interface structures. E influence of different interface structures and thicknesses on the thermal conductivity of Cu/Al joints was analyzed Three types of Cu/Al joints with different interfacial microstructures prepared by DB, FSW, and EW were obtained and evaluated. e microstructures and compositions of the Cu/Al joints were investigated. e thermal conductivity was estimated, and the corresponding interface thermal conductivity model was built. e influence of different interface structures and thicknesses on the thermal conductivity of Cu/Al joints was analyzed
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