Abstract
Curved optics of monocrystalline silicon plays an important role in high power laser system and its form accuracy and subsurface damage (SSD) have a significant impact on the performance of the laser system. In order to improve grinding accuracy and control the depth of SSD, the ultra-precision grinding (UPG) process of Si is studied. Firstly, the grinding theory is introduced and the relationships among the depth of cutting, the depth of subsurface cracks and the load of single particle are analysed. Then the influence of different process parameters on the surface quality of Si was investigated by some process experiments. Based on the result of process experiments, the processing of a 195 mm-diameter parabolic mirror of Si was carried out. The results show that the form accuracy of peak-valley value is promoted up to 3.77 μm from 21.4 μm and Rms value of the roughness is improved up to 0.11 μm from 0.625 μm.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
