Study on the solder flow in a narrow gap with metal surface texture

Abstract

Obvious voids in the solder in a narrow gap is a common problem that greatly affects the reliability of mechanical connections. Due to its high heating rate, laser soldering causes more severe voids and even evolves into dispersion of the solder. A method of metal surface texturing is put forward, in which the texture gradient is used to directionally transport solder for lower dispersity, and the pattern design of texture is used to reduce the void rate. The directional transport of solder is realized through the differences in oxidation degree and microstructure of stainless steel surface under different ultrafast laser scanning speeds. The discharge of voids in the solder is achieved through the reservation of the central area in the solder and the oscillation during the laser heating process. Based on the present method, the aggregation of solder is achieved, with the void rate of 18 % and the joining strength of 10.4 MPa.